Fully funded PhD scholarships at Bond University(via the Australian Government Research Training Program 2023)

About the position:

Bond University Higher Degree Scholarship: Australian Government Research Training Program (RTP) Scholarships 2023

Applications for Bond University RTP scholarships Round 1 for 2023 are open until March 31st. The Bond University RTP scholarships are provided by the commonwealth government of Australia to support eligible applicants undertaking PhD by research in their chosen field of study at Bond University.

The Bond University RTP scholarships provide tuition fees and living support for successful applicants. The RTP scholarships are awarded through a competitive merit-based process. The RTP scholarships at Bond University are offered to students who possess excellent academic merit and research potential.

Also apply for this University of Queensland Scholarships. Multiple fully funded MSc/Ph.D. scholarship positions for International Students

Bond University RTPS scholarships overview:

Scholarship type: Tuition fee wave
Degree Program: PhD
Available in: In all faculties
Number of awards: Limited positions
Location: Bond University, Australia
Citizen type: International students/Domestics
Application Deadlines: Two rounds.

Round 1: Closing date - 31 March 2023

Research Degree candidature must be submitted early enough to be considered for a scholarship round. Details are provided on the next few paragrams on how to submit an application for a research degree at Bond University.

Eligibility Criteria for Bond University RTP scholarships

Bond University applies a merit-based approach in determining eligible applicants for a scholarship. The scholarship will only be awarded to students based on academic excellence and research potential. The scholarship is open for commencing students or students intending to undertake a research degree at Bond University. To be considered for Bond University RTP scholarships, applicants must meet the following criteria:

Applicant must have a valid Bond University Letter of Offer for a doctoral program( meaning you must have applied and secured admissions into Bond University by the time you are submitting your RTP scholarship application)
Applicant must be studying a doctoral program full time
Applicant must be studying for a doctoral program

Note: If you have previously applied for a Higher Degree Scholarship at Bond University, and were unsuccessful, you are not eligible to reapply.

For further details on Bond University's assessment criteria visit the University Assessment of Scholarship Applications Framework

How to apply for Bond University RTP scholarships

To apply for Bond University Higher degree scholarships, applicants are expected to first submit candidature for a higher degree program at Bond University. At the time of applying for the scholarship, applicants must have received a valid Letter of Offer for admission to a doctoral research program from Bond University Admissions Department. To be considered for the scholarship, the applicant must apply for admission before the scholarship round deadline

To apply for admission to Bond University for a Research Degree Program, you will need to complete and submit an expression of interest (EOI) prior to completing an application. Make sure to apply early before the dude date of the scholarship round. To apply for a research degree admission and be considered for a scholarship, the following steps are needed:

Step 1 -Complete and submit Expression of interest (E0I) to Faculty. This is done online via Bond University Online Application Service. Before applicant starts their application, they are expected to submit an Expression of Interest (Eol) to the relevant faculty. Applicants will need to register and complete the Expression of Interest section of the application. The applicant will be assessed for the availability of supervision.
Step 2 - Apply for Admission to Bond University. If you are successful with your EoI, you will be notified of the outcome and will be invited back to proceed and complete your application via the same admission portal.
Step 3 - Apply for a Scholarship. Once admission has been secured, and you have received a letter of Offer, you can lodge your application for this scholarship using the same application portal, further details would be provided by the department of admissions.

Visit Bond University's admission page for further details on how to apply.

Applications for the RTP scholarships are done online via Bond University HDR admissions portals( Bond University Online Application Service). Applicants must apply using the Higher Degree Scholarship application form that can be accessed from the portal.

Some documents to get ready for the application include:

Research Project Proposal
Academic Transcripts including the results/grades awarded, information on institution grading systems/scales, and evidence of completion
Curriculum Vitae (CV) Please include any research publications and conference presentations
Prize and Award Certificates
Two referee reports

Who to contact

If facing any difficulty, or have a question regarding requirements, application procedures this can be directed to the Bond University Research Scholarships Officer, see contact details below

Research Scholarships Officer

Email: researchscholarships@bond.edu.au or
Email:HDR@bond.edu.au ,
Phone : +61 7 5595 1593

Visit the University website for further details on this scholarship.

Melbourne University Graduate Research Scholarships(GRS)2023-2024- up to 600 slots available for Masters and PhD research

See some helpful topics below to help you succeed with your applications

Pro-tips for research scholarship applications

The followings are some helpful links to browse through. They include tips and guides on how to successfully apply for research Masters and Ph.D. scholarships and admissions to study in Australia.

These are just some essential elements that any international student thinking to study abroad must be aware of especially when applying for research degree programs abroad.

This includes information about :